Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522633 | Methods and structures of novel contact feature | Wei-Hao Wu, Chia-Hao Chang, Chih-Hao Wang, Jia-Chuan You, Zhi-Chang Lin +2 more | 2019-12-31 |
| 10504775 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Cheng-Chi Chuang, Hsin-Ping Chen +1 more | 2019-12-10 |
| 10446555 | Buried metal track and methods forming same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2019-10-15 |
| 10276491 | Interconnect structure and methods thereof | Shang-Wen Chang | 2019-04-30 |
| 10170404 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge | 2019-01-01 |