Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504775 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Yi-Hsiung Lin, Hsin-Ping Chen +1 more | 2019-12-10 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2019-11-19 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2019-11-05 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2019-05-14 |
| 10276498 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2019-04-30 |