Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2019-11-26 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Cheng-Chi Chuang, Chia-Tien Wu | 2019-11-19 |
| 10340181 | Interconnect structure including air gap | Wei-Chen Chu, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2019-07-02 |
| 10325993 | Gate all around device and fabrication thereof | Yung-Chih Wang, Yu-Chieh Liao, Hsin-Ping Chen | 2019-06-18 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Cheng-Chi Chuang, Tien-Lu Lin | 2019-05-14 |
| 10276498 | Interconnect structure with air-gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2019-04-30 |
| 10269915 | Vertical MOS transistor and fabricating method thereof | Yung-Chih Wang, Shin-Yi Yang, Chih Wei Lu, Hsin-Ping Chen, Shau-Lin Shue | 2019-04-23 |
| 10177242 | Semiconductor arrangement and formation thereof | Tien-Lu Lin, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2019-01-08 |