Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522353 | Semiconductor epitaxy bordering isolation structure | Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Chin-Szu Lee | 2019-12-31 |
| 10522469 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Wei-Chen Chu | 2019-12-31 |
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2019-11-26 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2019-05-14 |
| 10276396 | Method for forming semiconductor device with damascene structure | Chia-Tien Wu, Wei-Chen Chu | 2019-04-30 |
| 10269715 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Wei-Chen Chu | 2019-04-23 |