Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522469 | Split rail structures located in adjacent metal layers | Hsiang-Wei Liu, Wei-Chen Chu | 2019-12-31 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Cheng-Chi Chuang | 2019-11-19 |
| 10475703 | Structure and formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2019-11-12 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2019-11-05 |
| 10276396 | Method for forming semiconductor device with damascene structure | Hsiang-Wei Liu, Wei-Chen Chu | 2019-04-30 |
| 10269715 | Split rail structures located in adjacent metal layers | Hsiang-Wei Liu, Wei-Chen Chu | 2019-04-23 |