Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522469 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Hsiang-Wei Liu | 2019-12-31 |
| 10483159 | Multi-metal fill with self-align patterning | Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu | 2019-11-19 |
| 10340181 | Interconnect structure including air gap | Tai-I Yang, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2019-07-02 |
| 10276396 | Method for forming semiconductor device with damascene structure | Hsiang-Wei Liu, Chia-Tien Wu | 2019-04-30 |
| 10269715 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Hsiang-Wei Liu | 2019-04-23 |