Issued Patents 2019
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515823 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Tien-I Bao +1 more | 2019-12-24 |
| 10515945 | Method and structure for semiconductor mid-end-of-year (MEOL) process | Chih Wei Lu, Chien-Hua Huang, Hsiang-Ku Shen, Zhao-Cheng Chen | 2019-12-24 |
| 10505018 | Spacers with rectangular profile and methods of forming the same | Yu-Sheng Chang, Tien-I Bao | 2019-12-10 |
| 10461246 | Memory device and method for manufacturing the same | Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, David Dai | 2019-10-29 |
| 10354954 | Copper etching integration scheme | Chih Wei Lu, Hsiang-Huan Lee, Tien-I Bao | 2019-07-16 |
| 10355198 | Memory device and fabrication method thereof | Wei-Hao Liao, Chih Wei Lu, Hsi-Wen Tien, Pin-Ren Dai | 2019-07-16 |
| 10340181 | Interconnect structure including air gap | Tai-I Yang, Wei-Chen Chu, Hsin-Ping Chen, Chih Wei Lu | 2019-07-02 |
| 10312139 | Interconnect structure having an etch stop layer over conductive lines | Cheng-Hsiung Tsai, Shau-Lin Shue, Tien-I Bao | 2019-06-04 |
| 10312136 | Etch damage and ESL free dual damascene metal interconnect | Sunil Kumar Singh, Tien-I Bao | 2019-06-04 |
| 10290536 | Structure and method for interconnection | Chih Wei Lu, Tien-I Bao | 2019-05-14 |
| 10283371 | Spacer-damage-free etching | Tsung-Min Huang, Yung-Hsu Wu | 2019-05-07 |
| 10270028 | Memory device and method for manufacturing the same | Hsi-Wen Tien, Chih Wei Lu, Wei-Hao Liao, Pin-Ren Dai | 2019-04-23 |
| 10269634 | Semiconductor device having voids and method of forming same | Yung-Hsu Wu, Chien-Hua Huang, Tien-I Bao, Shau-Lin Shue | 2019-04-23 |
| 10186455 | Interconnect structure and methods of making same | Tsung-Min Huang, Tsung-Jung Tsai | 2019-01-22 |
| 10170306 | Method of double patterning lithography process using plurality of mandrels for integrated circuit applications | Hsin-Chieh Yao, Shau-Lin Shue, Tien-I Bao, Yung-Hsu Wu | 2019-01-01 |