Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312139 | Interconnect structure having an etch stop layer over conductive lines | Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao | 2019-06-04 |
| 10262877 | Apparatus and method for reducing substrate sliding in process chambers | Sriskantharajah Thirunavukarasu, Kirankumar Neelasandra SAVANDAIAH, Kai Liang Liew | 2019-04-16 |