| 10504774 |
Lithographic patterning to form fine pitch features |
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2019-12-10 |
| 10497610 |
Dual photoresist approach to lithographic patterning for pitch reduction |
Ravi Prakash Srivastava |
2019-12-03 |
| 10453605 |
Insulating inductor conductors with air gap using energy evaporation material (EEM) |
Jagar Singh |
2019-10-22 |
| 10353288 |
Litho-litho-etch double patterning method |
Vineet Sharma, Sohan S. Mehta, Craig D. Higgins, Feng Wang |
2019-07-16 |
| 10347528 |
Interconnect formation process using wire trench etch prior to via etch, and related interconnect |
Ravi Prakash Srivastava, Sipeng Gu, Akshey Sehgal |
2019-07-09 |
| 10312188 |
Interconnect structure with method of forming the same |
Ravi Prakash Srivastava |
2019-06-04 |
| 10312136 |
Etch damage and ESL free dual damascene metal interconnect |
Chung-Ju Lee, Tien-I Bao |
2019-06-04 |
| 10177029 |
Integration of air gaps with back-end-of-line structures |
Robert J. Fox |
2019-01-08 |
| 10169156 |
Automatic restarting of containers |
Rajat Verma |
2019-01-01 |
