Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504851 | Structure and method to improve overlay performance in semiconductor devices | Cung D. Tran, Huaxiang Li, Bradley Morgenfeld, Xintuo Dai, Sanggil Bae +7 more | 2019-12-10 |
| 10504774 | Lithographic patterning to form fine pitch features | Sunil Kumar Singh, Sohan S. Mehta, SherJang Singh | 2019-12-10 |
| 10497610 | Dual photoresist approach to lithographic patterning for pitch reduction | Sunil Kumar Singh | 2019-12-03 |
| 10395941 | SADP method with mandrel undercut spacer portion for mandrel space dimension control | Hsueh-Chung Chen | 2019-08-27 |
| 10347528 | Interconnect formation process using wire trench etch prior to via etch, and related interconnect | Sunil Kumar Singh, Sipeng Gu, Akshey Sehgal | 2019-07-09 |
| 10312188 | Interconnect structure with method of forming the same | Sunil Kumar Singh | 2019-06-04 |
| 10192780 | Self-aligned multiple patterning processes using bi-layer mandrels and cuts formed with block masks | Xiaohan Wang, Jiehui Shu, Brendan O'Brien, Terry A. Spooner, Jinping Liu | 2019-01-29 |