Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347528 | Interconnect formation process using wire trench etch prior to via etch, and related interconnect | Sunil Kumar Singh, Ravi Prakash Srivastava, Sipeng Gu | 2019-07-09 |
| 10181420 | Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias | Jason E. Stephens, David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski +6 more | 2019-01-15 |