Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446483 | Metal-insulator-metal capacitors with enlarged contact areas | Jianwei Peng, Xusheng Wu, Yi Qi, Jeffrey Chee | 2019-10-15 |
| 10347528 | Interconnect formation process using wire trench etch prior to via etch, and related interconnect | Sunil Kumar Singh, Ravi Prakash Srivastava, Akshey Sehgal | 2019-07-09 |
| 10347531 | Middle of the line (MOL) contact formation method and structure | Xusheng Wu, Xinyuan Dou, Xiaobo Chen, Guoliang Zhu, Wenhe Lin +1 more | 2019-07-09 |
| 10211317 | Vertical-transport field-effect transistors with an etched-through source/drain cavity | Yi Qi, Xusheng Wu, Jianwei Peng, Hsien-Ching Lo | 2019-02-19 |