Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522679 | Selective shallow trench isolation (STI) fill for stress engineering in semiconductor structures | Ashish Jha, Hong Yu, Xusheng Wu, Dongil Choi, Edmund K. Banghart +1 more | 2019-12-31 |
| 10347531 | Middle of the line (MOL) contact formation method and structure | Sipeng Gu, Xusheng Wu, Xiaobo Chen, Guoliang Zhu, Wenhe Lin +1 more | 2019-07-09 |