Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522679 | Selective shallow trench isolation (STI) fill for stress engineering in semiconductor structures | Ashish Jha, Hong Yu, Xinyuan Dou, Xusheng Wu, Edmund K. Banghart +1 more | 2019-12-31 |
| 10461155 | Epitaxial region for embedded source/drain region having uniform thickness | Yoong Hooi Yong, Yanping Shen, Hsien-Ching Lo, Xusheng Wu, Joo Tat Ong +6 more | 2019-10-29 |