Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522679 | Selective shallow trench isolation (STI) fill for stress engineering in semiconductor structures | Ashish Jha, Hong Yu, Xinyuan Dou, Xusheng Wu, Dongil Choi +1 more | 2019-12-31 |
| 10347740 | Fin structures and multi-Vt scheme based on tapered fin and method to form | Xusheng Wu, Min-hwa Chi | 2019-07-09 |