Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2019-11-26 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2019-11-05 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Cheng-Chi Chuang | 2019-05-14 |
| 10276498 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2019-04-30 |
| 10177242 | Semiconductor arrangement and formation thereof | Tai-I Yang, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2019-01-08 |