Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Nan-Cheng Chen | 2019-12-24 |
| 10354974 | Structure and formation method of chip package structure | Shih-Chin Lin, Andrew C. Chang, Tao Cheng | 2019-07-16 |
| 10340198 | Semiconductor package with embedded supporter and method for fabricating the same | Ta-Jen Yu | 2019-07-02 |
| 10340199 | Packaging substrate with block-type via and semiconductor packages having the same | Tai-Yu Chen | 2019-07-02 |
| 10312222 | Semiconductor package and semiconductor device using the same | Shih-Chin Lin, Tao Cheng | 2019-06-04 |
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Ming-Jen Hsiung | 2019-03-26 |
| 10236242 | Chip package and package substrate | Ta-Jen Yu | 2019-03-19 |
| 10236187 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2019-03-19 |
| 10217716 | Semiconductor package and method for fabricating the same | Ta-Jen Yu, Yu-Sheng Hung | 2019-02-26 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Shih-Chin Lin, Tao Cheng, Andrew C. Chang | 2019-01-22 |