Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Tatyana N. Andryushchenko, Mauro J. Kobrinsky, Aleksandar Aleksov, David Staines | 2019-11-05 |
| 10461007 | Semiconductor package with electromagnetic interference shielding | Nachiket R. Raravikar | 2019-10-29 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Mitul Modi | 2019-06-18 |
| 10229887 | Systems and methods for electromagnetic interference shielding | Mitul Modi | 2019-03-12 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner, Eric J. Li | 2019-03-05 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Manish Dubey, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines | 2019-02-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |