Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515914 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel | 2019-12-24 |
| 10461007 | Semiconductor package with electromagnetic interference shielding | Rajendra C. Dias | 2019-10-29 |
| 10224299 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel | 2019-03-05 |
| 10181432 | Computing system with a thermal interface comprising magnetic particles | Ameya Limaye, Shubhada H. Sahasrabudhe | 2019-01-15 |