Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515914 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Neha M. Patel, Nachiket R. Raravikar | 2019-12-24 |
| 10224299 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Ken Hackenberg, Neha M. Patel, Nachiket R. Raravikar | 2019-03-05 |