Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Yu-Lung Huang, Yen-Shih Ho | 2018-12-11 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Ying-Nan Wen, Chi-Chang Liao, Yu-Lung Huang | 2018-11-27 |
| 10109663 | Chip package and method for forming the same | Yu-Lung Huang, Yi-Ming Chang, Hsin Kuan | 2018-10-23 |
| 10109559 | Electronic device package and fabrication method thereof | Chia-Sheng Lin, Yen-Shih Ho | 2018-10-23 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Po-Han Lee, Yen-Shih Ho | 2018-10-09 |
| 10050006 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Yen-Shih Ho | 2018-08-14 |
| 10049252 | Chip package and fabrication method thereof | Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN | 2018-08-14 |
| 9997473 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Sheng Lin, Chaung-Lin LAI | 2018-06-12 |
| 9978788 | Photosensitive module and method for forming the same | Yen-Shih Ho, Chi-Chang Liao | 2018-05-22 |
| 9966400 | Photosensitive module and method for forming the same | Chi-Chang Liao | 2018-05-08 |
| 9887229 | Sensing chip package and a manufacturing method thereof | Yen-Shih Ho, Chia-Sheng Lin, Chia-Ming Cheng | 2018-02-06 |
| 9881889 | Chip package and method for fabricating the same | Yu-Lung Huang, Shu-Ming Chang, Yen-Shih Ho | 2018-01-30 |