Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109663 | Chip package and method for forming the same | Yu-Lung Huang, Tsang-Yu Liu, Hsin Kuan | 2018-10-23 |
| 10050006 | Chip package and method for forming the same | Chia-Lun SHEN, Tsang-Yu Liu, Yen-Shih Ho | 2018-08-14 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Po-Han Lee, Hui-Hsien Wu +4 more | 2018-04-17 |
| 9881959 | Chip package and method of manufacturing the same | Po-Shen Lin, Chia-Sheng Lin | 2018-01-30 |
| 9875912 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Po-Han Lee, Hui-Hsien Wu +1 more | 2018-01-23 |