Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153237 | Chip package and method for forming the same | Chia-Sheng Lin, Po-Han Lee, Wei-Luen SUEN | 2018-12-11 |
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Yu-Lung Huang, Tsang-Yu Liu | 2018-12-11 |
| 10109559 | Electronic device package and fabrication method thereof | Chia-Sheng Lin, Tsang-Yu Liu | 2018-10-23 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2018-10-09 |
| 10049252 | Chip package and fabrication method thereof | Shu-Ming Chang, Tsang-Yu Liu, Hsing-Lung SHEN | 2018-08-14 |
| 10050006 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Tsang-Yu Liu | 2018-08-14 |
| 9997473 | Chip package and method for forming the same | Tsang-Yu Liu, Chia-Sheng Lin, Chaung-Lin LAI | 2018-06-12 |
| 9978788 | Photosensitive module and method for forming the same | Tsang-Yu Liu, Chi-Chang Liao | 2018-05-22 |
| 9947716 | Chip package and manufacturing method thereof | Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee, Hui-Hsien Wu +4 more | 2018-04-17 |
| 9887229 | Sensing chip package and a manufacturing method thereof | Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng | 2018-02-06 |
| 9881889 | Chip package and method for fabricating the same | Yu-Lung Huang, Shu-Ming Chang, Tsang-Yu Liu | 2018-01-30 |
| 9875912 | Chip package and manufacturing method thereof | Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee, Hui-Hsien Wu +1 more | 2018-01-23 |