Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Tsang-Yu Liu, Ying-Nan Wen, Yu-Lung Huang | 2018-11-27 |
| 9978788 | Photosensitive module and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu | 2018-05-22 |
| 9966400 | Photosensitive module and method for forming the same | Tsang-Yu Liu | 2018-05-08 |