Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157875 | Chip package and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-12-18 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Tsang-Yu Liu, Chi-Chang Liao, Yu-Lung Huang | 2018-11-27 |
| 10056419 | Chip package having chip connected to sensing device with redistribution layer in insulator layer | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-08-21 |
| 9966358 | Chip package | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-05-08 |
| 9935148 | Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-04-03 |