Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2018-12-11 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Tsang-Yu Liu, Ying-Nan Wen, Chi-Chang Liao | 2018-11-27 |
| 10109663 | Chip package and method for forming the same | Tsang-Yu Liu, Yi-Ming Chang, Hsin Kuan | 2018-10-23 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9881889 | Chip package and method for fabricating the same | Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2018-01-30 |
| 9865526 | Chip package and method for forming the same | — | 2018-01-09 |