Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153237 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Sheng Lin, Wei-Luen SUEN | 2018-12-11 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2018-10-09 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Hui-Hsien Wu +4 more | 2018-04-17 |
| 9875912 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Hui-Hsien Wu +1 more | 2018-01-23 |