Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Yu-Lung Huang, Tsang-Yu Liu, Yen-Shih Ho | 2018-12-11 |
| 10049252 | Chip package and fabrication method thereof | Yen-Shih Ho, Tsang-Yu Liu, Hsing-Lung SHEN | 2018-08-14 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9881889 | Chip package and method for fabricating the same | Yu-Lung Huang, Tsang-Yu Liu, Yen-Shih Ho | 2018-01-30 |