Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049252 | Chip package and fabrication method thereof | Yen-Shih Ho, Shu-Ming Chang, Tsang-Yu Liu | 2018-08-14 |
| 9972584 | Chip package and manufacturing method thereof | Jiun-Yen LAI, Yu-Ting Huang | 2018-05-15 |