Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157875 | Chip package and method for forming the same | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-12-18 |
| 10056419 | Chip package having chip connected to sensing device with redistribution layer in insulator layer | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-08-21 |
| 9966358 | Chip package | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-05-08 |
| 9935148 | Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-04-03 |