Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103068 | Detecting a void between a via and a wiring line | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2018-10-16 |
| 10049974 | Metal silicate spacers for fully aligned vias | Benjamin D. Briggs, Jessica Dechene, Joe Lee | 2018-08-14 |
| 10002831 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2018-06-19 |
| 9960117 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini | 2018-05-01 |
| 9911690 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Satyanarayana V. Nitta, David L. Rath | 2018-03-06 |
| 9905513 | Selective blocking boundary placement for circuit locations requiring electromigration short-length | Benjamin D. Briggs, Joe Lee, Christopher J. Penny | 2018-02-27 |
| 9881833 | Barrier planarization for interconnect metallization | Benjamin D. Briggs, Takeshi Nogami, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2018-01-30 |