Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852901 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Sesha Varadarajan, Saangrut Sangplung, Frank L. Pasquale, Ted Minshall, Adrien LaVoie +2 more | 2017-12-26 |
| 9793110 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2017-10-17 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Jun Qian, Chloe Baldasseroni, Frank L. Pasquale +8 more | 2017-10-17 |
| 9786570 | Methods for depositing films on sensitive substrates | Hu Kang, Adrien LaVoie, Jon Henri | 2017-10-10 |
| 9698042 | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge | Chloe Baldasseroni, Ted Minshall, Frank L. Pasquale, Ramesh Chandrasekharan | 2017-07-04 |
| 9673041 | Plasma assisted atomic layer deposition titanium oxide for patterning applications | Frank L. Pasquale, Adrien LaVoie | 2017-06-06 |
| 9631276 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Frank L. Pasquale, Chloe Baldasseroni +1 more | 2017-04-25 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Frank L. Pasquale, Adrien LaVoie, Chloe Baldasseroni, Hu Kang +7 more | 2017-04-18 |
| 9617638 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Hu Kang, Purushottam Kumar, Jun Qian, Frank L. Pasquale +1 more | 2017-04-11 |
| 9570274 | Plasma activated conformal dielectric film deposition | Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram, Vishwanathan Rangarajan +3 more | 2017-02-14 |
| 9570290 | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications | Frank L. Pasquale, Adrien LaVoie | 2017-02-14 |