Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852901 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Sesha Varadarajan, Shankar Swaminathan, Saangrut Sangplung, Ted Minshall, Adrien LaVoie +2 more | 2017-12-26 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni +8 more | 2017-10-17 |
| 9698042 | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge | Chloe Baldasseroni, Ted Minshall, Shankar Swaminathan, Ramesh Chandrasekharan | 2017-07-04 |
| 9673041 | Plasma assisted atomic layer deposition titanium oxide for patterning applications | Shankar Swaminathan, Adrien LaVoie | 2017-06-06 |
| 9631276 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Shankar Swaminathan, Chloe Baldasseroni +1 more | 2017-04-25 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Adrien LaVoie, Chloe Baldasseroni, Hu Kang, Shankar Swaminathan +7 more | 2017-04-18 |
| 9617638 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Hu Kang, Purushottam Kumar, Shankar Swaminathan, Jun Qian +1 more | 2017-04-11 |
| 9570290 | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications | Shankar Swaminathan, Adrien LaVoie | 2017-02-14 |