Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842798 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Yaojian Lin, Kang Chen, Yu Gu, Won Kyoung Choi | 2017-12-12 |
| 9842775 | Semiconductor device and method of forming a thin wafer without a carrier | Shuangwu Huang, Nathapong Suthiwongsunthorn | 2017-12-12 |
| 9837303 | Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units | Yaojian Lin, Kang Chen, Yu Gu | 2017-12-05 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Won Kyoung Choi +1 more | 2017-09-05 |
| 9721862 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Yaojian Lin | 2017-08-01 |
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2017-08-01 |
| 9721922 | Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package | Yaojian Lin, Won Kyoung Choi, Il Kwon Shim | 2017-08-01 |
| 9704780 | Semiconductor device and method of forming low profile fan-out package with vertical interconnection units | Il Kwon Shim, Yaojian Lin, Won Kyoung Choi | 2017-07-11 |
| 9704824 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Il Kwon Shim, Byung Joon Han | 2017-07-11 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Kang Chen, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2017-05-30 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2017-04-11 |
| 9607958 | Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation | Yaojian Lin, Kang Chen | 2017-03-28 |
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Yaojian Lin, See Chian Lim | 2017-01-31 |