| 9812370 |
III-V, SiGe, or Ge base lateral bipolar transistor and CMOS hybrid technology |
Josephine B. Chang, Gen P. Lauer, Jeffrey W. Sleight |
2017-11-07 |
| 9812321 |
Method for making nanosheet CMOS device integrating atomic layer deposition process and replacement gate structure |
Bruce B. Doris, Michael A. Guillorn, Xin Miao |
2017-11-07 |
| 9793398 |
Fabrication of a strained region on a substrate |
Jiaxing Liu, Renee T. Mo |
2017-10-17 |
| 9754965 |
Techniques for dual dielectric thickness for a nanowire CMOS technology using oxygen growth |
Josephine B. Chang, Michael A. Guillorn, Jeffrey W. Sleight |
2017-09-05 |
| 9755017 |
Co-integration of silicon and silicon-germanium channels for nanosheet devices |
Michael A. Guillorn, Nicolas Loubet |
2017-09-05 |
| 9748404 |
Method for fabricating a semiconductor device including gate-to-bulk substrate isolation |
Josephine B. Chang, Michael A. Guillorn, Xin Miao |
2017-08-29 |
| 9748348 |
Fully-depleted SOI MOSFET with U-shaped channel |
Takashi Ando, Robert H. Dennard, Ramachandran Muralidhar |
2017-08-29 |
| 9728624 |
Semiconductor testing devices |
Josephine B. Chang, Jeffrey W. Sleight, Tenko Yamashita |
2017-08-08 |
| 9691715 |
Support for long channel length nanowire transistors |
Karthik Balakrishnan, Tenko Yamashita, Jeffrey W. Sleight |
2017-06-27 |
| 9653547 |
Integrated etch stop for capped gate and method for manufacturing the same |
Josephine B. Chang, Bruce B. Doris, Michael A. Guillorn, Xin Miao |
2017-05-16 |
| 9647139 |
Atomic layer deposition sealing integration for nanosheet complementary metal oxide semiconductor with replacement spacer |
Bruce B. Doris, Michael A. Guillorn, Xin Miao |
2017-05-09 |
| 9627378 |
Methods of forming FINFETs with locally thinned channels from fins having in-situ doped epitaxial cladding |
Takashi Ando, Robert H. Dennard, Ramachandran Muralidhar, Ghavam G. Shahidi |
2017-04-18 |
| 9627330 |
Support for long channel length nanowire transistors |
Karthik Balakrishnan, Tenko Yamashita, Jeffrey W. Sleight |
2017-04-18 |
| 9601576 |
Nanowire FET with tensile channel stressor |
Chung-Hsun Lin, Jeffrey W. Sleight |
2017-03-21 |
| 9589791 |
Compound finFET device including oxidized III-V fin isolator |
Szu-Lin Cheng, Kuen-Ting Shiu, Jeng-Bang Yau |
2017-03-07 |
| 9570563 |
III-V compound and Germanium compound nanowire suspension with Germanium-containing release layer |
Guy M. Cohen, Alexander Reznicek, Jeffrey W. Sleight |
2017-02-14 |
| 9564502 |
Techniques for multiple gate workfunctions for a nanowire CMOS technology |
Josephine B. Chang, Michael A. Guillorn, Jeffrey W. Sleight |
2017-02-07 |
| 9564500 |
Fully-depleted SOI MOSFET with U-shaped channel |
Takashi Ando, Robert H. Dennard, Ramachandran Muralidhar |
2017-02-07 |
| 9558930 |
Mixed lithography approach for e-beam and optical exposure using HSQ |
Josephine B. Chang, Szu-Lin Cheng, Jeffrey W. Sleight |
2017-01-31 |
| 9548238 |
Method of manufacturing a semiconductor device using a self-aligned OPL replacement contact and patterned HSQ and a semiconductor device formed by same |
Szu-Lin Cheng, Jack O. Chu, Jeng-Bang Yau |
2017-01-17 |
| 9548355 |
Compound finFET device including oxidized III-V fin isolator |
Szu-Lin Cheng, Kuen-Ting Shiu, Jeng-Bang Yau |
2017-01-17 |
| 9543388 |
Complementary metal-oxide silicon having silicon and silicon germanium channels |
Gen P. Lauer, Alexander Reznicek, Jeffrey W. Sleight |
2017-01-10 |
| 9536885 |
Hybrid FINFET/nanowire SRAM cell using selective germanium condensation |
Josephine B. Chang, Leland Chang, Jeffrey W. Sleight |
2017-01-03 |
| 9536794 |
Techniques for dual dielectric thickness for a nanowire CMOS technology using oxygen growth |
Josephine B. Chang, Michael A. Guillorn, Jeffrey W. Sleight |
2017-01-03 |