Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526171 | Package structure and fabrication method thereof | Chi-Liang Shih, Te-Fang Chu, Hao-Ju Fang, Kuang-Neng Chung | 2016-12-20 |
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2016-11-29 |
| 9502758 | Electronic package and fabrication method thereof | Hao-Ju Fang, Chih-Hsien Chiu, Yude Chu, Tsung-Hsien Tsai | 2016-11-22 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Cho-Hsin Chang, Tsung-Hsien Hsu, Te-Fang Chu, Chia-Yang Chen | 2016-11-08 |
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Te-Fang Chu, Sheng-Ming Yang, Hung-Cheng Chen, Chia-Yang Chen | 2016-05-17 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Yude Chu | 2016-05-10 |
| 9257394 | Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package | Kuang-Neng Chung, Tien-Chung Huang, Tsung-Hsien Hsu | 2016-02-09 |