Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chao-Ya Yang | 2016-11-29 |
| 9502377 | Semiconductor package and fabrication method thereof | Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chih-Ming Cheng, Yude Chu | 2016-11-22 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Cho-Hsin Chang, Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu | 2016-11-08 |
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Sheng-Ming Yang, Hung-Cheng Chen | 2016-05-17 |