Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526171 | Package structure and fabrication method thereof | Hsin-Lung Chung, Te-Fang Chu, Hao-Ju Fang, Kuang-Neng Chung | 2016-12-20 |
| 9343401 | Semiconductor package and fabrication method thereof | Hsin-Lung Chung, Te-Fang Chu, Sheng-Ming Yang, Hung-Cheng Chen, Chia-Yang Chen | 2016-05-17 |