Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526171 | Package structure and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Hao-Ju Fang, Kuang-Neng Chung | 2016-12-20 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Cho-Hsin Chang, Tsung-Hsien Hsu, Hsin-Lung Chung, Chia-Yang Chen | 2016-11-08 |
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Sheng-Ming Yang, Hung-Cheng Chen, Chia-Yang Chen | 2016-05-17 |