Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Sheng-Ming Yang, Chia-Yang Chen | 2016-05-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Sheng-Ming Yang, Chia-Yang Chen | 2016-05-17 |