Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526171 | Package structure and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Hao-Ju Fang | 2016-12-20 |
| 9257394 | Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package | Hsin-Lung Chung, Tien-Chung Huang, Tsung-Hsien Hsu | 2016-02-09 |