Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257394 | Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package | Kuang-Neng Chung, Hsin-Lung Chung, Tsung-Hsien Hsu | 2016-02-09 |