Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508656 | Package structure and method for fabricating the same | Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2016-11-29 |
| 9502377 | Semiconductor package and fabrication method thereof | Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen, Chih-Ming Cheng, Yude Chu | 2016-11-22 |
| 9502758 | Electronic package and fabrication method thereof | Hsin-Lung Chung, Hao-Ju Fang, Yude Chu, Tsung-Hsien Tsai | 2016-11-22 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Hsin-Lung Chung, Yude Chu | 2016-05-10 |