Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502377 | Semiconductor package and fabrication method thereof | Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen, Chih-Ming Cheng | 2016-11-22 |
| 9502758 | Electronic package and fabrication method thereof | Hsin-Lung Chung, Hao-Ju Fang, Chih-Hsien Chiu, Tsung-Hsien Tsai | 2016-11-22 |
| 9355989 | Wire bonding device and method of eliminating defective bonding wire | Wei Lin, Lien-Chen Chiang, Lung-Tang Hung, Meng-Hung Yeh | 2016-05-31 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung | 2016-05-10 |
| 9289846 | Method for fabricating wire bonding structure | Wei Lin, Lung-Tang Hung, Meng-Hung Yeh, Zhi-Lun Hsieh | 2016-03-22 |