Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9355989 | Wire bonding device and method of eliminating defective bonding wire | Lien-Chen Chiang, Lung-Tang Hung, Meng-Hung Yeh, Yude Chu | 2016-05-31 | $2,483,000 |
| 9289846 | Method for fabricating wire bonding structure | Lung-Tang Hung, Meng-Hung Yeh, Zhi-Lun Hsieh, Yude Chu | 2016-03-22 | $4,386,000 |
| 9231883 | Service interface for QoS-driven HPNA networks | — | 2016-01-05 | $24,188,000 |