Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355989 | Wire bonding device and method of eliminating defective bonding wire | Wei Lin, Lien-Chen Chiang, Meng-Hung Yeh, Yude Chu | 2016-05-31 |
| 9289846 | Method for fabricating wire bonding structure | Wei Lin, Meng-Hung Yeh, Zhi-Lun Hsieh, Yude Chu | 2016-03-22 |