| 9520779 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff |
2016-12-13 |
| 9470439 |
Contaminant separator for a vapor-compression refrigeration apparatus |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2016-10-18 |
| 9437515 |
Heat spreading layer with high thermal conductivity |
Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz |
2016-09-06 |
| 9418976 |
Chip stack with electrically insulating walls |
Jae-Woong Nah |
2016-08-16 |
| 9348791 |
N × N connector for optical bundles of transmit / receive duplex pairs to implement supercomputer |
Monty M. Denneau, Daniel M. Kuchta |
2016-05-24 |
| 9342121 |
Cooling system for electronic components |
William J. Anderl, James D. Gerken, Christopher M. Marroquin, Shurong Tian |
2016-05-17 |
| 9313921 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang |
2016-04-12 |
| 9312761 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff |
2016-04-12 |
| 9272498 |
Precast thermal interface adhesive for easy and repeated, separation and remating |
Paul W. Coteus, Michael A. Gaynes, Kenneth C. Marston, Steven P. Ostrander |
2016-03-01 |
