| 9508589 |
Conductive layer routing |
Stanley Seungchul Song, Kern Rim, Zhongze Wang, Jeffrey Junhao Xu, Choh Fei Yeap |
2016-11-29 |
| 9431371 |
Semiconductor package with a bridge interposer |
Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp |
2016-08-30 |
| 9379058 |
Grounding dummy gate in scaled layout design |
Stanley Seungchul Song, Zhongze Wang, Ohsang Kwon, Kern Rim, John Jianhong Zhu +3 more |
2016-06-28 |
| 9331016 |
SOC design with critical technology pitch alignment |
Ohsang Kwon, Esin Terzioglu, Hadi Bunnalim |
2016-05-03 |
| 9318476 |
High performance standard cell with continuous oxide definition and characterized leakage current |
Ohsang Kwon, Foua Vang, Animesh Datta, Seid Hadi Rasouli |
2016-04-19 |
| 9293584 |
FinFET devices |
Henry Chen, Agnes Woo, Wei Xia |
2016-03-22 |
| 9293393 |
Stacked packaging using reconstituted wafers |
Kevin Kunzhong Hu, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan |
2016-03-22 |
| 9275976 |
System-in-package with integrated socket |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp |
2016-03-01 |
