Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431371 | Semiconductor package with a bridge interposer | Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-08-30 |
| 9349697 | Microbump and sacrificial pad pattern | Lynn Ooi | 2016-05-24 |
| 9293393 | Stacked packaging using reconstituted wafers | Kevin Kunzhong Hu, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-22 |
| 9275976 | System-in-package with integrated socket | Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-01 |