| 9431371 |
Semiconductor package with a bridge interposer |
Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Pieter Vorenkamp, Xiangdong Chen |
2016-08-30 |
| 9431370 |
Compliant dielectric layer for semiconductor device |
Sam Ziqun Zhao |
2016-08-30 |
| 9406636 |
Interposer package-on-package structure |
Sam Ziqun Zhao |
2016-08-02 |
| 9338880 |
Mutual capacitance and magnetic field distribution control for transmission lines |
Sampath Komarapalayam Velayudham Karikalan |
2016-05-10 |
| 9299634 |
Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages |
Sam Ziqun Zhao |
2016-03-29 |
| 9293393 |
Stacked packaging using reconstituted wafers |
Kevin Kunzhong Hu, Sam Ziqun Zhao, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen |
2016-03-22 |
| 9287189 |
Flexible routing for chip on board applications |
Milind S. Bhagavat, Javed Iqbal Sandhu, Teck Yang Tan |
2016-03-15 |
| 9275976 |
System-in-package with integrated socket |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen |
2016-03-01 |
| 9236442 |
Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections |
Milind S. Bhagavat, Sampath Komarapalayam Velayudham Karikalan |
2016-01-12 |
| 9230875 |
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding |
Sam Ziqun Zhao |
2016-01-05 |
